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印制电路和印制电路板

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标准编号 标准名称 状态 发布日期
IEC 61189-5-504 ed1.0 EN-FR Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) 现行 2020-04-21
IEC/TR 61189-5-506 ed1.0 EN Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 现行 2019-06-26
IEC 61188-6-4 ed1.0 EN-FR Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design 现行 2019-05-02
IEC 61188-7 ed1.0 EN_D Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction REVISED 暂无
IEC 61189-3 ed2.0 EN_D Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) 现行 暂无
IEC 61189-5 ed1.0 EN_D Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies 现行 暂无
IEC 61189-6 ed1.0 EN_D Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies 现行 暂无
IEC 61249-4-2 ed1.0 EN Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability 现行 暂无
IEC 61249-4-5 ed1.0 EN Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability 现行 暂无
IEC 62899-201 ed1.0 EN Printed electronics - Part 201: Materials - Substrates 现行 暂无
IEC 62899-201 ed1.1 EN Printed electronics - Part 201: Materials - Substrates 现行 暂无
IEC 62899-401 ed1.0 EN Printed electronics - Part 401: Printability - Overview 现行 暂无
IEC 61182-1 ed1.0 EN-FR Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form 废止 暂无
IEC 61182-7 ed1.0 EN-FR Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form 废止 暂无
IEC 61188-7 ed1.0 EN-FR Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction REVISED 暂无
IEC 61189-1 ed1.0 EN-FR Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology 现行 暂无
IEC 61189-1 ed1.1 EN-FR Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology 现行 暂无
IEC 61189-3 ed2.0 EN-FR Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) 现行 暂无
IEC 61189-5 ed1.0 EN-FR Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies 现行 暂无
IEC 61189-6 ed1.0 EN-FR Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies 现行 暂无
IEC 61191-6 ed1.0 EN-FR Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method 现行 暂无
IEC 61249-2-45 ed1.0 EN Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m?K) and defined flammability (vertical burning test), copper-clad for lead-free assembly 现行 暂无
IEC 61249-2-46 ed1.0 EN Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m?K) and defined flammability (vertical burning test), copper-clad for lead-free assembly 现行 暂无
IEC 61249-2-47 ed1.0 EN Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m?K) and defined flammability (vertical burning test), copper-clad for lead-free assembly 现行 暂无
IEC 62326-1 ed2.0 EN-FR Printed boards - Part 1: Generic specification 现行 暂无
IEC 62326-4 ed1.0 EN-FR Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification 现行 暂无
IEC 62496-1 ed1.0 EN-FR Optical circuit boards - Part 1: General 现行 暂无
IEC 61188-5-3 ed1.0 EN_D Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides 现行 暂无
IEC 61188-5-4 ed1.0 EN_D Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides 现行 暂无
IEC 61188-5-5 ed1.0 EN_D Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides 现行 暂无
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