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电子元器件组件

搜索结果: 63 个产品, 第 1 页, 共 3 页
标准编号 标准名称 状态 发布日期
IEC/TR 61191-7 ed1.0 EN Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies 现行 2020-03-11
IEC 62878-1 ed1.0 EN Device embedding assembly technology - Part 1: Generic specification for device embedded substrates 现行 2019-10-14
IEC 60068-2-69 ed3.1 EN-FR Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method 现行 2019-06-19
IEC 60068-2-69-am1 ed3.0 EN-FR Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method 现行 2019-06-19
IEC/TR 62878-2-7 ed1.0 EN Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards 现行 2019-03-20
IEC 61192-5 ed1.0 EN_D Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies 现行 暂无
IEC/PAS 62588 ed1.0 EN Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes 废止 暂无
IEC 60068-2-58 ed4.1 EN Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) 现行 暂无
IEC 61192-1 ed1.0 EN-FR Workmanship requirements for soldered electronic assemblies - Part 1: General 现行 暂无
IEC 61192-2 ed1.0 EN-FR Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies 现行 暂无
IEC 61192-3 ed1.0 EN-FR Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies 现行 暂无
IEC 61192-4 ed1.0 EN-FR Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies 现行 暂无
IEC 61192-5 ed1.0 EN-FR Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies 现行 暂无
IEC 61193-1 ed1.0 EN-FR Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies 现行 暂无
IEC 61193-3 ed1.0 EN-FR Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing 现行 暂无
IEC 61760-3 ed1.0 EN-FR Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering 现行 暂无
IEC 61760-4 ed1.0 EN-FR Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices 现行 暂无
IEC 61760-4 ed1.1 EN-FR Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices 现行 暂无
IEC 62137-3 ed1.0 EN-FR Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints 现行 暂无
IEC 62137-4 ed1.0 EN-FR Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices 现行 暂无
IEC 61190-1-3 ed2.0 EN_D Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications REVISED 暂无
IEC 62137-1-1 ed1.0 EN_D Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test 现行 暂无
IEC 62137-1-2 ed1.0 EN_D Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test 现行 暂无
IEC 60068-2-21 ed6.0 EN_D Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices 现行 暂无
IEC 60068-2-58 ed3.0 EN_D Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) REVISED 暂无
IEC 60068-2-69 ed2.0 EN_D Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method REVISED 暂无
IEC 60068-2-77 ed1.0 EN_D Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock 现行 暂无
IEC 61188-5-1 ed1.0 EN-FR Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements 现行 暂无
IEC 61188-5-2 ed1.0 EN-FR Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components 现行 暂无
IEC 61188-5-6 ed1.0 EN-FR Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides 现行 暂无
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