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电子设备用机械构件

搜索结果: 72 个产品, 第 1 页, 共 3 页
标准编号 标准名称 状态 发布日期
IEC 61969-3 ed3.0 EN-FR Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects 现行 2020-06-08
IEC 61969-3 ed3.0 RLV EN Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects 现行 2020-06-08
IEC 61969-1 ed3.0 EN-FR Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1: Design guidelines 现行 2020-05-12
IEC 61969-1 ed3.0 RLV EN Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1: Design guidelines 现行 2020-05-12
IEC 62610-6 ed1.0 EN Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 Series - Part 6: Air recirculation and bypass of indoor cabinets 现行 2020-03-25
IEC/TR 60286-7 ed1.0 EN-FR Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components 现行 2019-10-14
IEC 62966-1 ed1.0 EN-FR Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements 现行 2019-03-08
IEC 60286-3 ed6.0 EN-FR Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes 现行 2019-01-16
IEC 60286-3 ed6.0 RLV EN Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes 现行 2019-01-16
IEC 60286-2 ed3.0 EN_D Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes REVISED 暂无
IEC 61760-1 ed2.0 EN_D Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) 现行 暂无
IEC 61760-2 ed2.0 EN_D Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide 现行 暂无
IEC 60286-1 ed2.0 EN-FR Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes 现行 暂无
IEC 60286-2 ed3.0 EN-FR Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes REVISED 暂无
IEC 60286-2 ed4.0 EN-FR Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes 现行 暂无
IEC 60286-3 ed5.0 EN-FR Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes 现行 暂无
IEC 60286-4 ed3.0 EN-FR Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms 现行 暂无
IEC 60917-1 ed1.0 EN-FR Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard 现行 暂无
IEC 60917-1 ed1.1 EN-FR Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard 现行 暂无
IEC 60917-2 ed1.0 EN-FR Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice 现行 暂无
IEC 61191-1 ed2.0 EN-FR Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies REVISED 暂无
IEC 61191-1 ed3.0 EN-FR Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 现行 暂无
IEC 61191-2 ed2.0 EN-FR Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies REVISED 暂无
IEC 61191-3 ed1.0 EN-FR Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies 现行 暂无
IEC 61191-4 ed1.0 EN-FR Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies 现行 暂无
IEC 61587-1 ed3.0 EN-FR Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor conditions REVISED 暂无
IEC 61587-1 ed4.0 EN-FR Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation 现行 暂无
IEC 61587-2 ed2.0 EN-FR Mechanical structures for electronic equipment - Tests for IEC 60917 and 60297 - Part 2: Seismic tests for cabinets and racks 现行 暂无
IEC 61587-3 ed2.0 EN-FR Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks 现行 暂无
IEC 61587-4 ed1.0 EN-FR Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets 现行 暂无
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